At the core of Zefyr’s design is a high-thermal conduction interface compound, which enhances heat dissipation by providing a direct heat conduction path between MacBook’s bottom casing and Zefyr’s cast aluminum heat sink assembly.
At the core of Zefyr’s design is a high-thermal conduction interface compound, which enhances heat dissipation by providing a direct heat conduction path between MacBook’s bottom casing and Zefyr’s cast aluminum heat sink assembly.